WebAug 13, 2014 · Extremely high inspection speed. Highly accurate GR&R and CPK. ... Launched in November 2013, Opticon SPI-Line 3D is a full 3D solder paste inspection system with high-end features like a real time SPC tool, 3D inspection of sinter paste, etc. It has an ultra high speed 3D-sensor and is extremely user friendly. WebRequirements for Solder Paste Printing 1 GENERAL 1.1 Scope This standard is a collection of visual quality acceptability criteria for solder paste printing. 1.2 Purpose The purpose of this guideline document is to support the user in the visual evaluation of the solder
Global 3D Solder Paste Inspection (SPI) System Market Outlook …
Web• Conducted Operational qualification (OQ) test for Insituware EIS for Solder Paste Inspection. • Compared results of Flux Co-efficient (FC), Powder … WebNov 23, 2024 · The solder paste inspection machine can only perform image inspection on the surface, if there is an area covered by an object, it cannot be inspected. The solder paste inspection machine can measure the following data: Solder paste printing volume. Height of solder paste printing. Solder paste printing area. Flatness of solder paste printing. small pound cake recipe from scratch
Solder Paste Inspection Process - SURFACE MOUNT PROCESS
WebApr 8, 2016 · Her boss said, "This solder paste is cheaper. They seem to have a Cpk of greater than 2, so go visit them." She visited them. She wanted to see the raw data. Always ask to see the raw data. They were very hesitant about this, and, because, what happened is, when you looked at all the data together, the Cpk was just what she was getting – 1.5. WebJul 13, 2024 · Quantitative data is generated which allows solder paste performance to be measured. A solder paste evaluation is a good way to choose the best solder paste for your process. A solder paste evaluation starts with the selection of the solder pastes to be tested. It is common to choose multiple solder pastes of the same type for an evaluation. WebSolder voids are mainly caused by air bubbles contained in solder that is applied in the printing process of solder reflow, gasses that are generated in the component mounting process, and insufficient solder wettability of solder paste applied to concave parts. Solder voids can decrease solder strength, and partially decreased strength can ... small pound cake loaf recipes